December 2018

Israel-based RRAM developer Weebit Nano announced that its partnership with Leti continues, and Leti and Weebit extended the partnership to include adapting Weebit's RRAM production process to 300 mm wafers, at 28 nm.
Up until now Leti and Weebit's development was done on 200 mm wafers using 40 nm technology. Weebit believes that the move to 300 mm and 28 nm will be quick - and it will be done by the end of Q4 2019. The move to 28 nm will improve Weebit's RRAM cells and enable them to fit even the smallest geometries being used in the market today.

Market analyst firm Yole Developpement presents its latest next-generation memory forecasts in an interesting new article. The company says that following more than 15 years of development, PCM is finally taking off in stand-alone applications due to strong support from Intel and Micron.

While STT-MRAM is expected to lead the embedded memory race, Yole says that Stand-alone RRAM will try to catch market share to PCM on SCM application. RRAM was actually expected to be the first stand-alone technology to compete with 3D XPoint, but it has suffered repeated delays due to technical challenges. Yole expects RRAM to "return to the race for SCM" after 2020, and possibly start competing with NAND for mass storage applications.