RRAM production

China-based Xianxin Technology, in collaboration with several research institutes in China, have developed the world's first 28 nm image quality adjustment chip that is powered by embedded RRAM memory.

The company says it is now mass producing the new driver IC, which will be supplied to high-end miniLED LCD TV makers. The company says that by adopting RRAM rather than the mainstream external Flash memory, it enables faster read operations, and lower cost production. 

In October 2023 RRAM developer Weebit Nano announced that it has signed a licensing agreement with DB HiTek, a Korean-based foundry (said to be one of the world's top 10 foundries). The commercial agreement includes technology transfer, qualification and licensing.

Yesterday Weebit announced together with DB HiTek that it has taped-out (released to manufacturing) a demonstration chip integrating Weebit’s embedded RRAM module in DB HiTek’s 130nm Bipolar-CMOS-DMOS (BCD) process. The highly integrated demo chips will be used for testing and qualification ahead of customer production, while demonstrating the performance and robustness of Weebit’s technology.

Infineon says that its next generation Aurix TC4x microcontrollers will adopt RRAM memory, instead of the traditional embedded flash. The company expects the first samples of such chips to ship to customers before the end of 2023.

Infineo's next-gen Aurix chips will be produced at Taiwan Semiconductor Manufacturing Co (TSMC), using its 28nm CMOS process. The company says that RRAM memory will be more energy efficient at 28nm compared to the currently-used embedded flash memories. The RRAM memory will also enable higher disturb immunity and it allows for bit-wise writing without need for erase, which allows for superior performance over embedded flash. The cycling endurance and data retention are comparable with flash.

Israel-based RRAM developer Weebit Nano announced that it has received the silicon wafers from SkyWater Technology, with embedded Weebit RRAM. The company says this is an important step as its technology is now proven with standard tools and a mature process flow, which makes it easy for customers to dopt its technology.

The silicon SkyWater RRAM-enabled wafers will be sliced into chips, packaged, and then tested and qualified. The chips, which were manufactured in SkyWater’s 130nm CMOS process, will be used for customer demonstrations, testing and prototyping ahead of commercial orders and volume production, allowing customers to confidently start designing SoCs using these ReRAM modules.

Fujitsu Semiconductor Memory Solution announced the launch of a 12Mbit ReRAM chip, the MB85AS12MT. Fujitsu says that evaluation samples are currently available.

The MB85AS12MT offers a small package size (2mmx3mm) and a low level of average read current (0.15mA). Fujitsu targets applications in wearable devices such as hearing aids and smart watches.

Israel-based RRAM developer Weebit Nano announced that it has received from manufacturing the first silicon wafers that integrate its embedded ReRAM module inside complete subsystem demo chips.

These highly integrated chips will be used for testing, characterization and demonstration to potential customers. Weebit also updates that the transfer of the company's embedded ReRAM technology to SkyWater Technology's production fab is progressing on schedule.

Israel-based RRAM developer Weebit Nano has entered into its first commercial deal with US-based semiconductor foundry SkyWater Technologies. The deal includes a technology transfer agreement and a non-exclusive licensing agreement.

Weebit's ReRAM technology will be transferred to SkyWater’s production fab and then qualified for volume production by the end of 2022.

Israel-based RRAM developer Weebit Nano announced that it completed the design and the tape-out of its first embedded RRAM module. This integrated test-chip will be used as the final platform for testing and qualification, ahead of customer production.

Weebit says that it has used its patent-pending analog and digital smart circuitry to significantly enhance the array's technical parameters, including speed, retention and endurance. The test chip comprises a full sub-system in which the module is embedded, enabling potential customers to use it as a development and prototyping platform for new products such as low-energy IoT devices.

TSMC is developing RRAM technologies for several years, and the company first hoped to introduce its first embedded RRAM in 2019. This did not happen, but the company says it is now on track for first customer tape-outs in the second half of 2020.

TSMC will offer RRAM on its 40nm and 22nm manufacturing processes.